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Space Component Analysis Service

Introducing our space component analysis services, featuring tests such as X-ray observation and visual inspection!

We would like to introduce our "Space Component Analysis Service." In the "DPA (Destructive Physical Analysis) Test," we conduct DPA tests on components that require high reliability, such as those used in space applications. We offer various tests including dimensional measurement, visual inspection, and X-ray observation. Additionally, in the "Upscreening Test," we perform screening tests for aerospace components, including burn-in tests, temperature cycling tests, and solder wettability tests. 【Features】 <DPA (Destructive Physical Analysis) Test> ■ Reference Standards: MIL-STD-883 (MIL-STD-750, MIL-STD-1580, etc.) ■ Test Lineup - Visual inspection, X-ray inspection, hermeticity testing, PIND testing, material analysis, cross-section polishing, pull shear testing, SEM observation, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Testing Equipment and Devices
  • Contract Inspection
  • Other services

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Analysis of electronic circuits and components

Solving customer problems with advanced analysis and "analytical skills"! Introducing case studies of electronic circuit board analysis.

"Analysis of electronic substrates and components" offers surface analysis methods tailored to the customer's desired level of understanding. By utilizing various techniques, including FT-IR (reflective method and ATR method), XPS surface analysis, and AES depth analysis, we have resolved issues related to the copper surface of electronic substrate wiring patterns. 【Case Studies of Electronic Substrate Analysis (Wiring Patterns)】 ■ FT-IR (Reflective Method and ATR Method) ■ XPS Surface Analysis ■ AES Depth Analysis ■ TOF-SIMS Analysis ■ Thermal Decomposition GC/MS *For more details, please download the PDF or feel free to contact us.

  • Analytical Equipment and Devices
  • Contract Analysis

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